Curable resin composition, method for curing same, and sheet manufactured therefrom

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United States of America

PATENT NO 10590217
SERIAL NO

14415030

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Abstract

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Provided are a curable compound, a photoinitiator, and a curable resin composition comprising at least two types of thermal initiators, each having different initiation reaction temperature. Since the curable resin composition can improve a curing rate while having a high conversion rate, the curable resin composition is suitable for manufacturing thick films.

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Patent Owner(s)

Patent OwnerAddress
LG HAUSYS LTDSEOUL 150-721

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Dong Kwan Ulsan, KR 19 157
Lee, Min Hee Gunpo-si, KR 70 383

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