Lead frame and semiconductor package including the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10593613
SERIAL NO

15555359

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Disclosed are a lead frame for a semiconductor package, comprising: an anode 10, a cathode 20, a molding part 30, terminal parts 90 and 91, wherein one or more heat radiating holes 40, one or more chip attachment parts 50 which have a wider surface area than surface areas of semiconductor chips 55 to be attached, one or more upper openings 70 and 71 are positioned in an upper portion of the lead frame, and wherein one or more heat radiating holes 40, one or more first lower openings 60, and one or more second lower openings 80 are positioned in a lower portion of the lead frame; a semiconductor package including the lead frame; and a lighting apparatus including the semiconductor package.

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Patent Owner(s)

  • BK TECHNOLOGY CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Dong-Woo Gyeonggi-do, KR 109 1217

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