IC unit and method of manufacturing the same, and electronic device including the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10600696
APP PUB NO 20190287865A1
SERIAL NO

16421009

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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There are provided an Integrated Circuit (IC) unit, a method of manufacturing the same, and an electronic device including the IC unit. According to an embodiment, the IC unit includes a first source/drain layer, a channel layer and a second source/drain layer for a first device and a first source/drain layer, a channel layer and a second source/drain layer for a second device stacked in sequence on a substrate. In the first device, the channel layer includes a first portion and a second portion separated from each other. The first source/rain layer and the second source/drain layer each extend integrally to overlap both the first portion and the second portion of the channel layer. The IC unit further includes a first gate stack surrounding a periphery of the first portion and also a periphery of the second portion of the channel layer of the first device, and a second gate stack surrounding a periphery of the channel layer of the second device.

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Patent Owner(s)

  • INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zhu, Huilong Poughkeepsie, US 690 12414
Zhu, Zhengyong Beijing, CN 35 121

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