Bump-on-trace packaging structure and method for forming the same

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10600709
APP PUB NO 20180337106A1
SERIAL NO

16050669

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Abstract

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A device comprises a first package component, and a first metal trace and a second metal trace on a top surface of the first package component. The device further includes a dielectric mask layer covering the top surface of the first package component, the first metal trace and the second metal trace, wherein the dielectric mask layer has an opening therein exposing the first metal trace. The device also includes a second package component and an interconnect formed on the second package component, the interconnect having a metal bump and a solder bump formed on the metal bump, wherein the solder bump contacts the first metal trace in the opening of the dielectric mask layer.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Huang, Hui-Min Taoyuan, TW 110 1043
Huang, Kuei-Wei Hsinchu, TW 72 1278
Lin, Chih-Wei Zhubei, TW 359 5145
Lin, Wei-Hung Xinfeng Township, TW 175 1616
Liu, Chung-Shi Hsinchu, TW 824 11367

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