Heat exchanger for dual-sided cooling of electronic modules
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United States of America
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Mar 24, 2020
Grant Date -
Jun 14, 2018
app pub date -
Dec 13, 2017
filing date -
Dec 13, 2017
priority date (Note) -
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Abstract
A heat exchanger assembly has first and second heat sink elements enclosing fluid flow passages, and a clamping assembly. The heat sink elements are separated by a space in which at least one heat-generating electronic component is located, with outer side surfaces of each electronic component being in thermal contact with the heat sink elements. The clamping assembly has first and second spring elements arranged in contact with an outer surfaces of the heat sink elements. The spring elements are joined together to apply compressive forces to the heat sink elements and to cause the electronic components to be clamped between the heat sink elements. Each spring element has discrete force application regions for applying force to a heat sink element, and a plurality of fastening regions for compressing and maintaining the positions of the spring elements relative to the outer surfaces of the heat sink elements.
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