Die with aligning mechanism, and manufacturing device and method for enameled wire

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10603832
APP PUB NO 20180345560A1
SERIAL NO

15892559

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Abstract

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A die with alignment mechanism includes a die including a through-hole through which a traveling wire travels, a bearing member for rotationally moving the die in a circumferential direction of the traveling wire, and a movable member that moves the die so that a central axis of the through-hole is aligned with a travel direction of the traveling wire without inhibiting the rotational movement of the die produced by the bearing member when the travel direction changes in a direction orthogonal to the travel direction.

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Patent Owner(s)

Patent OwnerAddress
HITACHI METALS LTDMINATO-KU TOKYO 105-8614

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Funayama, Yasuhiro Tokyo, JP 25 91
Ishihara, Junji Tokyo, JP 11 61
Miyachi, Shinsuke Tokyo, JP 1 0
Nishimura, Takayoshi Tokyo, JP 2 0

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