Solvent-free light-curable adhesive composition

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United States of America

PATENT NO 10604681
APP PUB NO 20180163097A1
SERIAL NO

15579062

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Abstract

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A solvent-free light-curable adhesive composition includes: for example, a triazine ring-containing polymer including a repeating unit structure represented by formula [3] and having a weight-average molecular weight of 500-5000; and a reactive diluent such as N-vinylformamide, the composition not including a solvent. The solvent-free light-curable adhesive composition has good compatibility with acrylic materials and the like, which are adhesive components, even without including a solvent.

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Patent Owner(s)

Patent OwnerAddress
NISSAN CHEMICAL INDUSTRIES LTDTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maeda, Daisuke Funabashi, JP 68 252
Nishimura, Naoya Funabashi, JP 71 338

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