Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods
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United States of America Patent
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Issued Date -
Aug 4, 2016
app pub date -
Jan 29, 2016
filing date -
Jan 29, 2016
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Abstract
A method for producing a layer including a connecting medium on an assembly partner is provided. The method includes providing a carrier on which the connecting medium is applied. The connecting medium contains a metal in the form of a multiplicity of metal particles. The assembly partner is placed on the connecting medium located on the carrier and pressed onto the connecting medium located on the carrier, so that a layer of the connecting medium adheres to the assembly partner. The assembly partner together with the layer adhering thereto is removed from the carrier. By means of a gas flow, edges of the layer, at which the latter extends laterally beyond the assembly partner, are removed so that a layer residue of the layer remains adhering to the assembly partner.
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