Automatic method and device for cutting substrates having printed images
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United States of America Patent
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Issued Date -
May 23, 2019
app pub date -
May 11, 2017
filing date -
May 11, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a method for cutting substrates with printed images in an automatic cutting device. The longitudinal cutting marks (LM) are provided with a discontinuity (N) arranged upstream of each transverse cutting mark (TM) with respect to a feeding direction (F) of a substrate (S) and spaced therefrom by a predefined known measure (d). The automatic cutting device has a first optical unit configured to detect the transverse cutting marks (TM) and a second optical unit configured to detect the discontinuities (N) in the longitudinal cutting mark (LM). Since the velocity of the substrate is known, the control system activates the first optical unit when the transverse cutting mark (TM) actually passed underneath it.
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