Method for manufacturing circuit board
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United States of America Patent
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May 12, 2020
Grant Date -
Apr 18, 2019
app pub date -
Nov 17, 2017
filing date -
Oct 13, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A method for manufacturing the circuit board comprises following steps of providing an insulating substrate, and defining at least one through-hole on the insulating substrate to extending through two opposite surfaces of the insulating substrate; forming a silver layer on each of the two opposite surfaces, and forming a silver conductive structure in each through-hole connecting the silver layers; forming a copper wiring layer on the silver layers to cover each silver conductive structure and a portion region of the silver layers; and etching the silver layers to form a silver wiring layer corresponding to the copper wiring layer, wherein a first etching liquid, which does not etch the copper wiring layer, is used for etching the silver layers.
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