Method and device for coupling multiple ground planes
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United States of America Patent
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-
May 19, 2020
Grant Date -
Jul 19, 2018
app pub date -
Oct 24, 2017
filing date -
Jun 27, 2015
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.
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