Composite chip component, circuit assembly and electronic apparatus

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United States of America Patent

PATENT NO 10681815
APP PUB NO 20190200458A1
SERIAL NO

16286503

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Abstract

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The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.

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Patent Owner(s)

Patent OwnerAddress
ROHM CO LTDKYOTO-SHI KYOTO 615-8585

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Niino, Koichi Kyoto, JP 4 5
Nukaga, Eiji Kyoto, JP 8 11
Tamagawa, Hiroshi Kyoto, JP 25 92
Watanabe, Keishi Kyoto, JP 17 42

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