Power electronics assemblies having opticondistors and an embedded active cooling chip
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United States of America Patent
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Jun 16, 2020
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N/A
app pub date -
Jul 8, 2019
filing date -
Jun 25, 2018
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Abstract
An electronics assembly includes a first cooling chip made of a semiconductor material, and at least one subassembly mounted on the first cooling chip. The first cooling chip includes at least one metallization layer on a portion of a first surface of the first cooling chip, at least one inlet through a second surface of the first cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface of the first cooling chip, and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. The at least one subassembly includes one or more photonic cores positioned to receive light from a light source, wherein the one or more photonic cores comprise a wide band gap semiconductor material.
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