Polishing pad and polishing apparatus

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United States of America Patent

PATENT NO 10702970
APP PUB NO 20180193974A1
SERIAL NO

15863552

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Abstract

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The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.

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Patent Owner(s)

Patent OwnerAddress
SAN FANG CHEMICAL INDUSTRY CO LTD402 FENGJEN RD JENWU DIST KAOHSIUNG CITY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Chung-Chih Kaohsiung, TW 112 308
Hung, Yung-Chang Kaohsiung, TW 45 119
Liu, Wei-Te Kaohsiung, TW 10 28
Wang, Lyang-Gung Kaohsiung, TW 21 42
Wu, Wen-Chieh Kaohsiung, TW 53 137
Yao, I-Peng Kaohsiung, TW 79 189

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