Method of manufacturing laminated electronic component
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United States of America Patent
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Jul 7, 2020
Grant Date -
Mar 29, 2018
app pub date -
Sep 21, 2017
filing date -
Sep 26, 2016
priority date (Note) -
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Abstract
A method of manufacturing a laminated electronic component having a circuit element formed in an element body. The method includes forming a collective laminated body including a plurality of element bodies having circuit elements formed therein by laminating pluralities of insulator layers and conductor patterns; forming a plurality of external terminals on one of surfaces of the collective laminated body orthogonal to a lamination direction; forming a disappearing layer covering the external terminals and caused to disappear by heat treatment; cutting and dividing the collective laminated body having the disappearing layer formed thereon along the lamination direction into each of element bodies; applying an insulator precursor to a surface of the element body; and forming a laminated electronic component by applying a heat treatment to the element body to which the insulator precursor is applied. In the method, the insulator layers can be replaced by magnetic material layers.
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