Electrically conducting thermally conductive polymer resin composition based on styrenics with balanced properties

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United States of America Patent

PATENT NO 10717911
APP PUB NO 20180282604A1
SERIAL NO

15765780

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Abstract

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Thermally conductive polymer (TCP) resin compositions are described, comprising: 50 to 75% matrix polymer (I) comprising styrenic polymers (Γ) such as ABS (acrylonitrile-butadiene-styrene) resins, ASA (acrylonitrile-styrene-acrylate) resins and elastomeric block copolymers of the structure (S-(B/S))n-S; and 25 to 50% thermally conductive filler material (II) (D50 0.1 to 200 μm), consisting of carbonyl iron powder (11-1) in mixture with multi wall carbon nanotubes, silicon carbide, diamond, graphite, aluminosilicates and/or boron nitride (II-2); wherein the volume ratio of (ll-1)/(ll-2) is 15:1 to 0.1:1. Shaped articles made thereof can be used for materials with antistatic finish, electrical and electronic housings, toys and helmet inlays.

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Patent Owner(s)

Patent OwnerAddress
INEOS STYROLUTION GROUP GMBH60325 FRANKFURT

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kolb, Tristan Bayreuth, DE 10 12
Michaelis, De Vasconcellos Janna Sprockhoevel, DE 6 13
Michels, Gisbert Leverkusen, DE 55 237
Niessner, Norbert Friedelsheim, DE 156 700
Schmidt, Hans-Werner Bayreuth, DE 80 1590
Schulz, Tobias Cologne, DE 33 31
Wieberger, Florian Bamberg, DE 3 12

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