Method of forming a hole in a coated component
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United States of America Patent
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Jul 28, 2020
Grant Date -
Feb 7, 2019
app pub date -
Aug 3, 2017
filing date -
Aug 3, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
Methods for forming a hole in a coated component are provided. The method may include forming a sacrificial layer over a ceramic barrier coating of a substrate, drilling a hole into the coated component such that any spatter formed during drilling deposits onto the sacrificial layer, and removing the sacrificial layer along with the spatter deposited thereon. The sacrificial layer may include a rare earth oxide (e.g., rare earth oxide particles). Intermediate ceramic matrix composite (CMC) component are also provided. The intermediate CMC may include a CMC body, an environmental barrier coating on the bond coating, and a sacrificial layer on the environmental barrier coating, with the sacrificial layer including particles of a rare earth oxide dispersed in a polymeric matrix.
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