Electronic component and manufacturing method thereof
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United States of America Patent
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-
Aug 4, 2020
Grant Date -
N/A
app pub date -
Mar 11, 2019
filing date -
Sep 17, 2018
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic component and a manufacturing method thereof are disclosed. The electronic component includes a substrate, a conductor pattern portion disposed on the substrate, a first electrode pattern and a second electrode pattern disposed on the conductor pattern portion, at least one dummy conductor pattern disposed to be spaced apart from the conductor pattern portion and disposed on the substrate, and at least one dummy electrode pattern disposed on the at least one dummy conductor pattern. A width of the first electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the first electrode pattern, and a width of the second electrode pattern is substantially the same as a width of a portion of the conductor pattern portion in contact with the second electrode pattern.
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