Development unit, substrate processing apparatus, development method and substrate processing method

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United States of America Patent

PATENT NO 10754251
APP PUB NO 20190041755A1
SERIAL NO

16073861

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Abstract

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A substrate having a film of a coating liquid containing metal is held by a spin chuck, the film having been exposed in a predetermined pattern. A slit nozzle supplies a development liquid to a surface to be processed of the substrate supported by the spin chuck. A cleaning liquid for removing or dissolving metal is supplied by a cleaning nozzle to the surface to be processed of the substrate to which the development liquid has been supplied.

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Patent Owner(s)

Patent OwnerAddress
SCREEN HOLDINGS CO LTDTENJINKITA-MACHI 1-1 TERANOUCHI-AGARU 4-CHOME HORIKAWA-DORI KAMIGYO-KU KYOTO-SHI KYOTO 602-8585

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asai, Masaya Kyoto, JP 21 56
Harumoto, Masahiko Kyoto, JP 44 328
Kaneyama, Koji Kyoto, JP 69 700
Tanaka, Yuji Kyoto, JP 302 2044

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