Method of manufacturing a chip component

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United States of America Patent

PATENT NO 10763016
APP PUB NO 20190148040A1
SERIAL NO

16231937

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Abstract

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A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.

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Patent Owner(s)

Patent OwnerAddress
ROHM CO LTD21 SAIIN MIZOSAKI-CHO UKYO-KU KYOTO-SHI KYOTO 6158585 ?6158585

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kondo, Yasuhiro Kyoto, JP 133 968
Matsuura, Katsuya Kyoto, JP 21 89
Tamagawa, Hiroshi Kyoto, JP 25 92
Yamamoto, Hiroki Kyoto, JP 381 4704

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