Electrochemical or chemical treatment device for high aspect ratio circuit board with through hole
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United States of America Patent
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Sep 8, 2020
Grant Date -
N/A
app pub date -
Dec 13, 2019
filing date -
Dec 13, 2019
priority date (Note) -
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Abstract
The present invention relates to an electrochemical or chemical treatment device for high aspect ratio circuit board with through hole comprises: an electroplating tank; a solution storage tank; a positioning frame, the positioning frame fixes the circuit board inside the electroplating tank for the electroplating tank to be divided into a solution accumulated area and a suction area by the positioning frame and the circuit board; a priming piping sucking solution from the solution storage tank to the solution accumulated area; a suction cap corresponding to the suction area; and a suction piping connected to the suction cap, using the negative pressure produced by suction to make the solution flow through the through hole of the circuit board, and further having a better result of electroplating the bore of through hole of the high aspect ratio circuit board.
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