Chip capacitor and method for manufacturing the same

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United States of America Patent

PATENT NO 10777360
APP PUB NO 20190244763A1
SERIAL NO

16385876

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Abstract

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A chip capacitor and a method for manufacturing the chip capacitor, where the chip capacitor includes a substrate, a first external electrode disposed on the substrate, a second external electrode disposed on the substrate, capacitor elements formed on the substrate and connected between the first external electrode and the second external electrode, and fuses that are formed on the substrate, are each interposed between the capacitor elements and the first external electrode or the second external electrode, and are capable of disconnecting each of the capacitor elements.

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Patent Owner(s)

Patent OwnerAddress
ROHM CO LTDKYOTO-SHI KYOTO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fuwa, Yasuhiro Kyoto, JP 28 121
Okada, Hiroyuki Kyoto, JP 239 2898

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