Circuit module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10797003
APP PUB NO 20190267330A1
SERIAL NO

16284457

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A circuit module 2 comprises: a wiring structure 4; an electronic component 6a, 6b arranged on the upper surface of the wiring structure 4; an insulating resin layer 8 which is provided on the upper surface of the wiring structure 4 and in which the electronic component 6a, 6b is embedded; and a metal layer 10 provided on a side surface S1 of the insulating resin layer 8 and a side surface S2 of the wiring structure 4. The surface roughness of the side surface S1 of the insulating resin layer 8 is expressed as R1. The surface roughness of the side surface S2 of the wiring structure 4 is expressed as R2. R1 and R2 differ from each other.

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Patent Owner(s)

Patent OwnerAddress
TDK CORPORATIONTOKYO 103-6128

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sato, Hironori Tokyo, JP 176 1246
Takizawa, Shuichi Tokyo, JP 30 152
Yoshino, Atsushi Tokyo, JP 15 73

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