Wafer centering device for measurement apparatus

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United States of America Patent

PATENT NO 10818533
APP PUB NO 20180261485A1
SERIAL NO

15755208

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Abstract

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The present invention provides a wafer centering device for a measurement apparatus, the device comprising: a body unit; a guide unit which is installed in the body unit, has a support part for supporting a wafer, and has a through-hole and; and a displacement unit which is formed to be moved in the through-hole and has a pusher for moving the wafer on the support part.

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Patent Owner(s)

Patent OwnerAddress
SEMICONDUCTOR ENERGY LABORATORY CO LTD398 HASE ATSUGI-SHI KANAGAWA-KEN 243-0036

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jung, Hye-Suk Gyeonggi-do, KR 1 0
Kwon, Young-Jong Gyeonggi-do, KR 3 12
Lee, Gyu-Seong Gyeonggi-do, KR 1 0

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