Multilayer electronic component and mounting structure thereof
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United States of America Patent
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Nov 3, 2020
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N/A
app pub date -
Jul 16, 2020
filing date -
Jul 17, 2019
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Abstract
To improve a mounting reliability while maintaining a thickness of the external electrode at a side face of a multilayer electronic component thin. The multilayer electronic component includes ceramic body in which ceramic layers and an external electrode formed to an end face of the ceramic body. The upper electrode layer includes an element having higher standard electrode potential than Cu. The external electrode includes an external electrode end part and an external electrode extension part which is integrally formed with the external electrode end part. 1.20≤t2/t1≤4.50 is satisfied in which t1 is a total thickness of a thickness of the intermediate electrode layer thickness and t2 is a length from an end of the base electrode layer to an end of the upper electrode layer along the first axis of the external electrode extension part connected by the conductive adhesive.
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