High fidelity feedthrough system
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United States of America Patent
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Nov 24, 2020
Grant Date -
Jul 30, 2020
app pub date -
Jan 25, 2019
filing date -
Jan 25, 2019
priority date (Note) -
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Abstract
A system for the manufacturing of high-fidelity insulated components is described. Per field requirements, components crafted via the process are hermetically sealed, and are configured to employ appropriately matched materials in accordance with their inherent properties of thermal expansion. A pin, glass insulator, and ferule are present. As opposed to conventional insulated components which employ stainless steel as an inefficient conductor, the unique matching process of the system provides for the use of copper and silver alloys to maximize efficiency while maintaining a hermetic seal. Specific glass is selected in accordance with the desired alloy in order to maintain similar degrees of expansion and contraction per temperature variations.
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