Room temperature debondable and thermally curable compositions

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United States of America Patent

PATENT NO 10867830
APP PUB NO 20190088525A1
SERIAL NO

16169960

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Abstract

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Embodiments in accordance with the present invention are directed to a method of fabricating a semiconductor device wherein a device wafer substrate is coated with a composition encompassing a surface energy modifier and a thermally stable polymer which is then bonded to a carrier wafer substrate coated with a composition encompassing a crosslinkable polymer composition. The polymer composition allows thinning of a device wafer before separating from the carrier wafer at room temperature.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO BAKELITE CO LTDTOKYO 140-0002

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dukkipati, Venkat R Newport Beach, US 2 1
Rhodes, Larry F Brecksville, US 116 936
Wei, Xianhe Medford, US 5 2

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