Device package including molding compound having non-planar top surface around a die and method of forming same
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United States of America Patent
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Dec 15, 2020
Grant Date -
N/A
app pub date -
Oct 21, 2019
filing date -
Nov 26, 2014
priority date (Note) -
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Abstract
A device package includes a die and a molding compound around the die. The molding compound has a non-planar surface recessed from a top surface of the die. The device package also includes an interconnect structure over the die. The interconnect structure includes a redistribution layer extending onto the molding compound and conformal to the non-planar surface of the molding compound. The device package further includes a first connector disposed over the die and bonded to the interconnect structure.
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