Printed circuit board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10912194
SERIAL NO

16673813

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Abstract

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Generally, the present disclosure provides example embodiments relating to a printed circuit board (PCB). In an embodiment, a structure includes a PCB including insulating layers with respective metal layers being disposed therebetween. Each of first layers of the insulating layers includes a first fiberglass content. A second layer of the insulating layers has a second fiberglass content less than the first fiberglass content. For example, in some embodiments, the second insulating layer does not include a fiberglass matrix.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chu, Li-Huan Hsinchu, TW 32 78
Lu, Tsung-Hsing Hsinchu County, TW 17 23
Tsao, Pei-Haw Tai-chung, TW 119 1288

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