Method of manufacturing printed circuit board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10912202
APP PUB NO 20170135223A1
SERIAL NO

15406132

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Abstract

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A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

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Patent Owner(s)

Patent OwnerAddress
LG INNOTEK CO LTDSEOUL 07796

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, Yun Mi Seoul, KR 17 18
Choi, Dae Young Seoul, KR 16 1
Hwang, Jung Ho Seoul, KR 39 132
Jeon, Jae Hoon Seoul, KR 16 196
Jeong, Dong Hun Seoul, KR 18 1
Jeong, In Ho Seoul, KR 31 124
Kim, Sang Hwa Seoul, KR 49 238
Kwon, Soon Gyu Seoul, KR 13 2
Lee, Han Su Seoul, KR 17 48
Lee, Jin Hak Seoul, KR 19 164
Lee, Sang Young Seoul, KR 119 1559
Son, Kil Dong Seoul, KR 3 0

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