Compositions and methods for selectively etching titanium nitride

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United States of America Patent

PATENT NO 10920141
APP PUB NO 20160130500A1
SERIAL NO

14896197

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Abstract

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Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., cobalt, ruthenium and copper, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.

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Patent Owner(s)

Patent OwnerAddress
MORGAN STANLEY SENIOR FUNDING INC1300 THAMES STREET 4TH FLOOR BALTIMORE MD 21231

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Li-Min Norwalk, US 34 249
Cooper, Emanuel I Scarsdale, US 71 1001
Lippy, Steven Brookfield, US 13 325
Song, Lingyan Fort Collins, US 12 138

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