Slip-plane MEMS probe for high-density and fine pitch interconnects

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10935573
APP PUB NO 20200103440A1
SERIAL NO

16145571

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Abstract

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A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tadayon, Pooya Portland, US 90 313
Walczyk, Joe Tigard, US 21 86

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