Thermal-curable adhesive composition and adhesive sheet

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United States of America Patent

PATENT NO 10947417
APP PUB NO 20190100679A1
SERIAL NO

15719624

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Abstract

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The instant disclosure provides a thermal-curable adhesive composition and adhesive sheet. The thermal-curable adhesive composition has a rate of change of adhesion ranging from 80% to 98% and defined by the following equation: V=[(V0−V1)/V0]×100, wherein V is the rate of change of adhesion of the thermal-curable adhesive composition, V0 is the adhesion of the thermal-curable adhesive composition under room temperature, and V1 is the adhesion of the thermal-curable adhesive composition after being heated to a predetermined temperature then cooled to the room temperature.

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Patent Owner(s)

Patent OwnerAddress
TAIMIDE TECH INCNO 127 SEC 3 WENDER RD SHINPU JEN HSINCHU 30541

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lai, Chun-Ting Hsinchu, TW 10 6
Lin, Chih-Wei Hsinchu, TW 359 5145

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