Aqueous bonding composition

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United States of America Patent

PATENT NO 10947426
APP PUB NO 20180155583A1
SERIAL NO

15883185

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Abstract

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Disclosed is an aqueous bonding composition comprises: (A) a saccharide; (B) an inorganic acid ammonium salt; and (C) a metal salt, wherein the metal salt (C) comprises at least one selected from potassium salts, calcium salts, sodium salts, and magnesium salts. The aqueous bonding composition is excellent in balance among bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength. The aqueous bonding composition can be usefully used to produce a wood-based material. Further, a wood-based material obtainable by using the aqueous bonding composition is provided.

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAA40589 DÜSSELDORF

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kakuda, Atsushi Osaka, JP 4 4
Yoshida, Yoshio Osaka, JP 100 1092

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