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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
HITACHI METALS LTD	2-70 KONAN 1-CHOME MINATO-KU TOKYO

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• H01M:PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT....
• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
• C22F:CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS MET....
• C21D:MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS....
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
• B21B:ROLLING OF METAL
• C22C:ALLOYS

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Yamamoto, Shinji	Suita, JP	421	8069

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Sep 23, 2028
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Sep 23, 2032

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 23, 2021	US,10953630,B2   US10953630B2	GRANTED PATENT AS SECOND PUBLICATION
February 14, 2019	US,20190047256,A1   US20190047256A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 10953630

Method for manufacturing clad material

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