Capacitor and electronics module assembly with low-inductance connection features
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United States of America Patent
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May 4, 2021
Grant Date -
N/A
app pub date -
Oct 16, 2019
filing date -
Oct 16, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A capacitor includes an electrically insulating housing that encloses an interior volume, first and second conductive connection pads that are each configured as externally accessible points of electrical contact to internal electrodes of the capacitor that are disposed within the housing, and an active capacitor dielectric material disposed within the housing and being configured as a dielectric medium between the internal electrodes, the first conductive connection pad having a first planar contact surface that is substantially parallel to a first sidewall of the housing, the second conductive connection pad having a second planar contact surface that is substantially parallel to the first sidewall, the first and second planar contact surfaces being offset from one another in a direction that is orthogonal to the first sidewall.
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