Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrate

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United States of America Patent

PATENT NO 11015087
APP PUB NO 20190092974A1
SERIAL NO

16133686

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Abstract

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A polishing composition according to the present invention includes: silica; an anionic water-soluble polymer; at least one compound selected from the group consisting of a phosphonate group-containing compound, a phosphate group-containing compound, and an amino group-containing compound; and a dispersing medium.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATED1-1 CHIRYO 2-CHOME NISHIBIWAJIMA-CHO KIYOSU-SHI AICHI 452-8502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tseng, Tzu-Chun Tongluo Township, TW 6 49

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