Manufacturing method of capacitor structure

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United States of America Patent

PATENT NO 11024704
SERIAL NO

16802481

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Abstract

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A manufacturing method of a capacitor structure includes the following steps. A first capacitor is formed on a substrate. The first capacitor includes a first electrically conductive pattern and a second electrically conductive pattern of a first electrically conductive layer and a first dielectric layer disposed therebetween in a horizontal direction. A second capacitor is formed on the substrate before forming the first capacitor. The second capacitor includes a third electrically conductive pattern and a fourth electrically conductive pattern of a second electrically conductive layer and a second dielectric layer disposed therebetween in the horizontal direction. A thickness of the second electrically conductive layer is monitored. A target value of a thickness of the first electrically conductive layer is controlled in accordance with a value of a monitored thickness of the second electrically conductive layer.

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Patent Owner(s)

Patent OwnerAddress
UNITED SEMICONDUCTOR (XIAMEN) CO LTDNO 899 WAN JIA CHUN ROAD XIAMEN XIANG'AN XIAMEN FUJIAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Wei-Chun Fujian, CN 44 110
Huang, Han-Min Hsinchu, TW 9 58
Jhang, You-Di New Taipei, TW 13 29
Tan, Wen Yi Fujian, CN 81 17

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