Method of forming copper alloy sputtering targets with refined shape and microstructure

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United States of America Patent

PATENT NO 11035036
APP PUB NO 20190233935A1
SERIAL NO

16247232

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Abstract

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A method of forming a copper manganese sputtering target including subjecting a copper manganese billet to a first unidirectional forging step, heating the copper manganese billet to a temperature from about 650° C. to about 750° C., subjecting the copper manganese billet to a second unidirectional forging step, and heating the copper manganese billet to a temperature from about 500° C. to about 650° C. to form a copper alloy.

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Patent Owner(s)

Patent OwnerAddress
HONEYWELL INTERNATIONAL INC101 COLUMBIA ROAD POB 2245 MORRISTOWN NJ 07962-2245

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Alford, Frank C Spokane Valley, US 16 78
Ferrasse, Stephane Spokane, US 35 389
Nolander, Ira G Spokane, US 6 37
Turner, Erik L Spokane, US 2 1
Underwood, Patrick Spokane, US 17 289

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