Film forming method for metal film and film forming apparatus for metal film
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United States of America Patent
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Jun 15, 2021
Grant Date -
Mar 28, 2019
app pub date -
Sep 19, 2018
filing date -
Sep 28, 2017
priority date (Note) -
In Force
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Abstract
A solid electrolyte membrane is disposed between an anode and a substrate, and voltage is applied between the anode and the substrate while the solid electrolyte membrane is pressed onto the substrate so as to form a metal film on the substrate. In this film forming method, there is used the solid electrolyte membrane that includes: a first portion made of an ion permeable material; and a second portion made of a material having an electric insulating property and having a low permeability of metallic ions, the second portion being embedded in the first portion so as to be exposed from a surface of the solid electrolyte membrane, the surface of the solid electrolyte membrane facing the substrate.

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Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TOYOTA JIDOSHA KABUSHIKI KAISHA | 1 TOYOTA-CHO TOYOTA-SHI AICHI-KEN 471-8571 |
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- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Iisaka, Hirofumi | Nagoya, JP | 23 | 141 |
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