Semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11049856
APP PUB NO 20200388609A1
SERIAL NO

16488541

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Abstract

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Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

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Patent Owner(s)

Patent OwnerAddress
NUVOTON TECHNOLOGY CORPORATION JAPANNAGAOKAKYO CITY KYOTO 617-8520

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Tsubasa Osaka, JP 12 43
Okawa, Ryosuke Nara, JP 28 174
Yoshida, Kazuma Kyoto, JP 40 461

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