Circuit board, method of manufacturing circuit board, and electronic device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11057996
APP PUB NO 20190289715A1
SERIAL NO

16430735

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Importance

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Abstract

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A circuit board includes: a first substrate including a first through hole, a first metal layer formed over an inner wall of the first through hole, and a first conductive composite resin provided on an inner side of the first metal layer of the first through hole; and a second substrate stacked together with the first substrate and including a second through hole that faces the first through hole and has a first open end which is provided on a side of the first through hole and is located on the inner side of the first metal layer, and a second conductive composite resin that is provided in the second through hole and is coupled to the first conductive composite resin.

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Patent Owner(s)

Patent OwnerAddress
FICT LIMITED36 OAZA KITAOWARIBE NAGANO-SHI NAGANO 381-8501

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iwai, Toshiki Atsugi, JP 35 52
Mizutani, Daisuke Sagamihara, JP 50 468
Sakai, Taiji Yokohama, JP 46 318
Sakuyama, Seiki Yamato, JP 58 398

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