Silicon ingot slicing apparatus using microbubbles and wire electric discharge machining

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United States of America Patent

PATENT NO 11065783
APP PUB NO 20180133928A1
SERIAL NO

15584481

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Abstract

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Provided are a silicon ingot slicing apparatus capable of slicing silicon ingots in various forms such as blocks or wafers using microbubbles and wire electric discharge machining.

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Patent Owner(s)

Patent OwnerAddress
KOREA INSTITUTE OF ENERGY RESEARCH152 GAJEONG-RO YUSEONG-GU DAEJEON 34129

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Sun-Ho Gongju-si, KR 14 93
Jang, Bo-Yun Daejeon, KR 18 62
Kim, Joon-Soo Daejeon, KR 120 1654
Moon, Hui-Chan Daejeon, KR 1 1

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