Thermal compensation layers with core-shell phase change particles and power electronics assemblies incorporating the same
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United States of America Patent
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Jul 20, 2021
Grant Date -
Apr 30, 2020
app pub date -
Oct 25, 2018
filing date -
Oct 25, 2018
priority date (Note) -
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Abstract
A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100° C. to 250° C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.
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