Wafer and wafer producing method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11072042
APP PUB NO 20200223015A1
SERIAL NO

16739454

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Abstract

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A wafer producing method includes a peel-off layer forming step of applying a laser beam of a wavelength passing through a hexagonal single crystal ingot with a focal point of the laser beam positioned at a depth corresponding to a thickness of a wafer to be produced from an end face of the hexagonal single crystal ingot to form a peel-off layer, a production history forming step of applying a laser beam of a wavelength passing through the wafer with a focal point of the laser beam positioned inside the wafer at a position corresponding to each of a plurality of devices to be formed on a front surface of the wafer to form a production history, and a wafer peeling step of peeling off the wafer from the hexagonal single crystal ingot.

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Patent Owner(s)

Patent OwnerAddress
DISCO CORPORATIONTOKYO 143-8580

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sekiya, Kazuma Tokyo, JP 212 1461

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