Method of forming wiring on side portion of substrate

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United States of America Patent

PATENT NO 11098401
SERIAL NO

16449476

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Abstract

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Disclosed is a method of forming wiring of a substrate includes masking a substrate side portion, on which the wiring will be formed, by attaching a deposition mask to the substrate; and forming the wiring on the substrate side portion based on sputtering after introducing the masked substrate into a chamber.

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Patent Owner(s)

Patent OwnerAddress
TETOS CO LTD288-9 YEONAMYULGEUM-RO EUMBONG-MYUN ASAN-SI 31413
JIANGSU ZHIXINDA TECHNOLOGY CO LTDROOM 111 4/F BUILDING 5 JUU CHUANGYUAN NO 29 NORTH ROAD SHANBEI STREET LIANGXI DISTRICT WUXI CITY 214000

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Park, Yeong Ung Cheonan-si, KR 1 0
Song, Kun Ho Asan-si, KR 8 14

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