Chip module, signal processing method, and electronic equipment
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United States of America Patent
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Aug 24, 2021
Grant Date -
Aug 1, 2019
app pub date -
Oct 4, 2017
filing date -
Oct 18, 2016
priority date (Note) -
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Abstract
The present technology relates to a chip module, a signal processing method, and electronic equipment that are aimed at enabling a change before and after mounting a module to be debugged and enabling a mounting module to be easily designed. A gyro module includes a MEMS that is formed into a chip and an IC that processes a detection signal from the MEMS, which are arranged above and below. The IC has a temperature sensor and stress sensor that detect an external environment within the IC in plurality and outputs difference values obtained by subtracting reference sensor values that are sensor values of the temperature sensors and the stress sensors at the time of calibration from sensor values detected by a plurality of the temperature sensors and the stress sensors respectively. The present technology can be applied, for example, to the gyro module or the like.
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