Systems and methods for copper etch rate monitoring and control
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United States of America Patent
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Aug 24, 2021
Grant Date -
Oct 24, 2019
app pub date -
Dec 6, 2017
filing date -
Dec 9, 2016
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Abstract
Systems and methods for copper etch monitoring and control are described. Certain embodiments include utilizing thin-film cells to measure the absorbance of a copper etch solution to determine the etch rate of the solution. In another embodiment, a method of controlling etch rate of a copper etch solution includes detecting characteristics of the copper etch solution utilizing a sensor device, e.g., flow cell and/or attenuated total reflection probe, calculating, based on the detected characteristics of the copper etch solution, the etch rate of the copper etch solution, and adjusting the etch rate of the copper etch solution in response to the calculated etch rate deviating from a specified value.
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