Method of manufacturing a polymer printed circuit board

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United States of America Patent

PATENT NO 11102891
APP PUB NO 20190174637A1
SERIAL NO

16265956

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Abstract

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A method of manufacturing a polymer printed circuit board contains in a sequential order steps of: A), B), C), D, and F). In the step A), a material layer consisting of polymer is provided. In the step B), circuit pattern is formed on the material layer. In the step C), metal nanoparticles are deposited on the laser induced graphene (LIG) of the circuit pattern so as to use as a material seed. In the step D) a metal layer on the nanoparticles are deposited and the LIG of the circuit pattern are formed. In the step E), the circuit pattern is pressed. In the step E), the circuit pattern, the material layer, the metal nanoparticles, and the metal layer are pressed in a laminating manner to obtain the polymer printed circuit board.

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Patent Owner(s)

Patent OwnerAddress
BGT MATERIALS LIMITEDMANCHESTER M13 9PL

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Kuo-Hsin Chiayi, TW 40 65
Chen, Jia-Cing Tainan, TW 18 25
Ke, We-Jei Hsinchu County, TW 6 6
Lai, Chung-Ping Hsinchu County, TW 69 148
Zhang, Jingyu Hweian, CN 51 269

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