Cu-Al-Mn-based alloy material, method of producing the same, and rod material or sheet material using the same

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United States of America Patent

PATENT NO 11118255
APP PUB NO 20160376688A1
SERIAL NO

15264113

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Abstract

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A Cu—Al—Mn-based alloy material (1) having a composition comprising: given contents of Al and Mn, and a given total content of at least one selected from Ni and the like; with the balance being Cu and unavoidable impurities, wherein the alloy material has a shape elongated in the working direction (RD), wherein a grain length ax in the RD is R/2 or less to the width or diameter (R), a grain length bx in a direction perpendicular to the RD is R/4 or less, and the amount of grains X (2) is 15% or less, and wherein a grain length a in the RD and a grain length b in the direction perpendicular to the RD satisfy: a≥b, and an angle formed by the normal line of the (111) plane and the RD is 15° or larger, the amount of grains Y′ (3) is 85% or more.

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Patent Owner(s)

Patent OwnerAddress
TOHOKU UNIVERSITY2-1-1 KATAHIRA AOBA-KU SENDAI-SHI MIYAGI 9808577
FURUKAWA ELECTRIC CO LTD6-4 OTEMACHI 2-CHOME CHIYODA-KU TOKYO 100-8322
FURUKAWA TECHNO MATERIAL CO LTDKANAGAWA 254-0016

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujii, Misato Hiratsuka, JP 5 4
Ishikawa, Koji Hiratsuka, JP 60 495
Kainuma, Ryosuke Sendai, JP 33 278
Kise, Sumio Hiratsuka, JP 10 15
Nakamizo, Kenji Hiratsuka, JP 11 18
Omori, Toshihiro Sendai, JP 32 146
Tanaka, Toyonobu Hiratsuka, JP 13 58

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